1) material: FR-4, FR-1, CEM-1, CEM-3, FR-4 Halogen Free
2)layer: 1-16
3)board thickness: 0.4mm-3.2mm
4)copper thickness: 0.5oz, 1.0oz, 2oz, 3oz,
5)min. drilled hole size: 0.2mm
6)width/space: 4/4mil(0.1/0.1mm)
7)surface finish: HASL, Lead free HASL, OSP, Gold-plating, Chemical silver, Chemical gold(ENIG), Chemical tin, Carbon ink,
8)solder mask color: green, yellow, black, white, red, blue
9)profiling: Punching, Routing, V-cut, Golden finger, Beveling
10)V-cut angle: 20°25°30°45
11)Beveling angle: 20°25°30°45°
12)Max working panel: 24*20 (610mm*508mm)
13)E-test voltage: 50-300V
14)Certificate: UL, ISO9001, ISO14001, ISO/TS 16949, RoHS
15)Impedance control:
Microstrip impedance: 50-60 Tolerance: ±10%
Differential Impedance: 90-120, Tolerance: ±10%
16)Quality standard: IPC-A-600F
(optional dimension for discussion)
Al-base pcb